Potting
Typical product：AS-301421, AS-3027B, AS-380101
By filling a complete electronic assembly with a solid compound for preventing from shock or vibration, and for exclusion of moisture and corrosive agents, the sensitive electronic components can be protected completely.
Recommend product：AS-301421, AS-3027B, AS-380101
Those products are one-component epoxy adhesives whcih can provide good and strong bonding to plastic and metal.
| Product | AS-301421 | AS-3027B | AS-380101 |
|---|---|---|---|
| Feature | Low modulus | Low CTE | High Tg/Low CTE COB |
| Viscosity | 8,000mPa.s | 70,000mPa.s | 55,000mPa.s |
| Curing condition | 150℃/10min | 140℃/30min | 150℃/120min |
| Tg | 50℃ | 120℃ | 145℃ |
| CTE | 78 ppm | 31 ppm | 14 ppm |
| Modulus | 2.5GPa | － | 12GPa |
| Tensile shear modulus | >18MPa | >18MPa | 10MPa |
If you have any questions or require development, please feel free to contact us
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